- The MX30x series are manual one-point Thickness gauges for silicon wafers.
Categories: E+H Metrology, Electrical & Electronics, Inspection, Test & Measurement Equipment, Semiconductor, Wafer Geometry Gauge
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate is a set of capacitive distance sensors. The wafer will be moved or automatically between the plates and measured without any movement.
Applications
- Incoming inspection of Wafers
- R&D
- Qualification of processes
- In-process control for
- Thickness (e.g. backend)
- TTV
- Warp, FPD
- Stress
