Precision systems for wafer surface measurement in semiconductor processes.
Categories: Automated Wafer Measurement System, Semiconductor, Semiconductor Advanced Metrology System (AMS Series), Wafer Surface Measurement
WSM1300 is designed for measuring the areal and surface of 8” and 12” wafer surface. System comes with one load port, 3-axis Hirata single arm ATM robot, wafer pre-aligner module and mapping sensor to provide higher performance and effective wafer handling. It’s equipped with non-contact type 3D optical profilometer which consists of high technology measurement feature such as Confocal, Interferometry and Ai Focus Variation, along with excellent analysis feature. It’s also integrated with vibration isolation platform to deliver accurate and fast measurement process.
Specifications
- Designed for 200mm and 300mm Wafer
- One Load Port for 12” FOUP & 8” Open Cassette
- Hirata 3-Axis Single Arm ATM Robot
- Hirata Wafer Pre-aligner for Wafer Orientation Check and Wafer Alignment
- IOSS WID120 OCR Reader
- Sensofar S-Neox Non-Contact Type 3D Optical Profilometer
- Objective Lenses at 10x and 20x
- Vibration Isolation Platform
- TCP/IP Networking For Interface With Host Map Server, and Storage Of Map Data Over The Network
- SECS/GEM Communication Tools (Optional)
