Wafer Surface Measurement System – WSM1300
Precision systems for wafer surface measurement in semiconductor processes. Categories: Automated Wafer Measurement System, Semiconductor, Semiconductor Advanced Metrology System (AMS Series), Wafer Surface Measurement WSM1300 is designed for measuring the areal and surface of 8” and 12” wafer surface. System comes with one load port, 3-axis Hirata single arm ATM robot, wafer pre-aligner module and […]
Wafer Surface Measurement System – WSM1200
Precision systems for wafer surface measurement in semiconductor processes. Categories: Automated Wafer Measurement System, Semiconductor, Semiconductor Advanced Metrology System (AMS Series), Wafer Surface Measurement WSM1200 is designed for measuring the areal and surface of 6” and 8” wafer surface. System comes with one load port, 3-axis Hirata single arm ATM robot, wafer pre-aligner module and […]
Wafer Roughness Measuring System – MPS2100
The MP2100 is Chapman Instruments’ latest high-resolution proler. Specially designed for surface measurements and analysis, it can be used as both a production tool for inline quality inspection, as well as a research and development tool for establishing standards and researching tolerances
Wafer Thickness & Roughness Measuring System – MPT1000
Categories: Automated Wafer Measurement System, Semiconductor, Semiconductor Advanced Metrology System (AMS Series), Wafer Roughness Measuring, Wafer Thickness & Roughness Measuring The MPT1000 is Chapman Instruments’ latest non-contact system, providing wafer thickness measurements. It can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data […]